The NIST Physical Measurement Laboratory (PML), Microsystems and Nanotechnology Division (MND), CHIPS R&D Program (https://www.nist.gov/chips/metrology-community) as part of the CHIPS Act activities (Grand Challenge 5: Modeling and Simulating Semiconductor Manufacturing Processes), is now developing imaging and measurement solutions for integrated circuit (IC) overlay metrology using a scanning electron microscope (SEM). IC production relies on measurements of the 3D size, shape, and placement of structures with atomic-level precision and repeatability. The project, titled “SEM Overlay Metrology Based on Physics Model and Artificial Intelligence,” will create a sound scientific foundation and comprehensive solutions for SEM-based overlay and dimensional metrology superior to currently used arbitrary methods. This will allow the design of overlay patterns, acquisition, and image analysis to be optimized entirely through artificial intelligence, physics-based simulation, and modeling and meet IC production requirements now and in the future. For this work, samples that contain patterns used for overlay measurements and relevant to current IC technologies are indispensable.

NIST is seeking information from sources that may be capable of providing a commercial solution that will achieve the objectives described above, in addition to the following essential requirements: 

NIST MND requires high-speed, distributable Monte Carlo software (MC SW) suitable for SEM-based measurements of IC overlay structures by accurately simulating and modeling the electron-solid interactions and generating images for artificial (AI) metrology solutions. For this, high-speed generation of secondary and backscattered images using the physics of signal generation is indispensable. The MC SW must be implemented in the NIST CPU Cluster. 

1. Sophisticated, 3D sample geometry, material definition, and visualization by graphical user interface
2. Many shape primitives spheres, cylinders, cones, frustum, and surface roughness for easy simulation scene definition
3. Current state-of-the-art secondary electron generation physics models implemented
4. Create a database of material physical models for materials used in IC production, e.g., Si, SiO2, Si3N4, etc.
5. Structures, such as overly, dense and isolated IC lines, and contact holes, as predefined structures, made available and ready to be used
6. 3D representation of the simulated/modeled results
7. Batch processing capability
8. Capability to run on CPU clusters and efficiently gather and visualize simulated results by a CPU cluster

HOW TO RESPOND TO THIS NOTICE

In responding to this notice, please DO NOT PROVIDE PROPRIETARY INFORMATION. Please include only the following information, readable in either Microsoft Word 365, Microsoft Excel 365, or .pdf format, in the response:  Submit the response by email to the Primary Point of Contact and, if specified, to the Secondary Point of Contact listed in this notice as soon as possible, and preferably before the closing date and time of this notice.  Please note that to be considered for award under any official solicitation, the entity must be registered and “active” in SAM at the time of solicitation response.

• Provide the complete name of your company, address, name of contact for follow-up questions, their email, their phone number and, if your company has an active registration in https://sam.gov, your company’s Unique Entity ID (UEI).

• Identify the equipment that your company sells that can meet the objectives addressed in the BACKGROUND section of this notice.  For each product recommended to meet the Government’s requirement, provide the following:
  • Manufacturer name
  • Model number
  • Technical specifications
  • If your company is not the manufacturer, provide information on your company’s status as an authorized reseller of the product(s)

• Describe performance capabilities of the product(s) your company recommends to meet the Government’s requirements.  Additionally, if there are other features or functions that you believe would assist NIST in meeting its objectives described above, please discuss in your response.
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• Identify any aspects of the NIST market research notice, including instructions, and draft minimum specifications in the BACKGROUND section you cannot meet and state why.  Please offer suggestions fo