Die Bonding and Vacuum Packaging System | app.rfpplanner.com

Opportunity Details

Solicitation Number: N0017326QKN05

Date Added: August 04, 2026

Description:

https://api.sam.gov/prod/opportunities/v1/noticedesc?noticeid=c4eb0db47a1d4e639aa964038a2b45fb

Set-Aside: N/A (N/A)

Place of Performance: N/A, District of Columbia, UNITED STATES

NAICS Codes:
333993

Files:

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